FormFactor and Teradyne Enter Broad Semiconductor Testing Collaboration – Unite.AI

FormFactor and Teradyne have entered into a broad technology collaboration aimed at testing next-generation semiconductors, the companies said in a joint announcement on October 12, 2026, with Teradyne also agreeing to make a $300 million strategic equity investment in FormFactor’s common stock.

The collaboration combines FormFactor’s expertise in probe technologies, interface solutions, test engineering and device characterization with Teradyne’s automated test platforms. The release identifies FormFactor as a provider of semiconductor test and measurement technologies and Teradyne as a provider of automated test equipment and advanced robotics, and describes the collaboration as bringing together the two companies’ positions in probe, interface and test technologies to accelerate artificial intelligence and high-performance computing deployments.

According to the announcement, the collaboration aims to accelerate the development, validation and deployment of high-volume manufacturing of next-generation semiconductor devices and help customers address the growing complexity of semiconductors. The companies said they will collaborate to advance semiconductor test architectures, optimize test infrastructures and improve manufacturing readiness for existing and emerging applications, including high-performance computing, advanced packaging, high-bandwidth memory and silicon photonics.

The companies said they believe the collaboration will accelerate innovation in the semiconductor testing ecosystem, from the wafer to the data center. They also said they expect the partnership to expand opportunities for joint customer engagement and support growing demand for advanced computing, artificial intelligence infrastructure and next-generation semiconductor technologies.

Equity investment of $300 million

Under the terms of the agreement, Teradyne agreed to purchase shares of FormFactor common stock in a $300 million strategic equity investment. The transaction is subject to customary closing conditions and regulatory approvals, the companies said.

Statements from both CEOs

Mike Slessor, CEO of FormFactor, said the semiconductor industry is entering a period where test performance, scalability and time to market are becoming critical competitive advantages. He said combining FormFactor’s expertise in device characterization, probing, interfaces and production test solutions with Teradyne’s test platforms can help customers accelerate innovation and move more efficiently from technology development to high-volume manufacturing.

Teradyne President and CEO Gregory Smith said the most demanding testing challenges in advanced packaging, silicon photonics and memory cannot be solved by a single company. He said investing in FormFactor and combining Teradyne’s test platforms with FormFactor’s probe and interface expertise creates what he described as a more complete and validated manufacturing path for the two companies’ shared customers, while strengthening the company’s commitment to an open and interoperable ecosystem.

Recent announcements at each company

Teradyne’s official editorial board lists the following announcements from 2026. On April 16, 2026, Teradyne acquired TestInsight, a deal the company described as accelerating time to market for AI and data center devices. On June 8, 2026, it introduced an integrated testing solution for AI devices and data centers in collaboration with Tokyo Electron. Teradyne launched UltraFLEXplus advanced tools designed for AI computing devices and data centers on September 1, 2026. On September 14, 2026, the company opened an office in India, a move it described as deepening its commitment to the country’s growing semiconductor ecosystem. It announced the Magnum E2 on September 29, 2026 to address next-generation memory testing needs driven by AI and high-performance computing, and introduced the HP Titan platform with burn-in capabilities for advanced AI data center devices on October 6, 2026. On October 12, 2026, the date of the collaboration announcement, Teradyne introduced the UltraFLEXplus S series for edge AI applications.

FormFactor’s investor relations release shows that the company has been added to the US large-cap Russell 1000 index as of June 29, 2026. On July 28, 2026, FormFactor announced a strategic partnership with Keystone Microtech to expand semiconductor probe board manufacturing and testing capabilities for advanced semiconductor applications, in a release posted in Livermore, California and Zhubei, Taiwan. On July 29, 2026, the company reported second-quarter 2026 results, which it said delivered record revenue, gross profit and earnings per share, and said it saw strong demand for DRAM, foundry, logic and systems. FormFactor is scheduled to report third quarter 2026 financial results on October 28, 2026.